世界のウェーハレベルパッケージ市場規模・現状・予測（2021年-2027年）

• 英文タイトル：Global Wafer Level Package Market Size, Status and Forecast 2021-2027

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レポート概要

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QYResearch社発行の本調査レポートでは、ウェーハレベルパッケージの世界市場（2016年～2027年）を対象に調査し、市場動向、主要企業の市場シェア、種類別市場規模（3Dワイヤーボンディング、3D TSV、その他）、用途別市場規模（家電、産業、自動車・運輸、IT・通信、その他）、主要地域別市場規模（北米、アメリカ、欧州、アジア、日本、中国、韓国、インド、東南アジア、中南米、中東、アフリカ等）、企業情報などをまとめております。 ・市場概要 ・ウェーハレベルパッケージの市場動向 ・企業の競争状況、市場シェア ・ウェーハレベルパッケージの種類別市場規模と予測2016-2027（3Dワイヤーボンディング、3D TSV、その他） ・ウェーハレベルパッケージの用途別市場規模と予測2016-2027（家電、産業、自動車・運輸、IT・通信、その他） ・ウェーハレベルパッケージの北米市場規模2016-2027（アメリカ、カナダ） ・ウェーハレベルパッケージの欧州市場規模2016-2027（ドイツ、フランス、イギリス等） ・ウェーハレベルパッケージのアジア市場規模2016-2027（日本、中国、韓国、インド、東南アジア等） ・ウェーハレベルパッケージの中南米市場規模2016-2027（メキシコ、ブラジル） ・ウェーハレベルパッケージの中東・アフリカ市場規模2016-2027（トルコ、サウジアラビア等） ・主要企業情報（lASE、Amkor、Intel、Samsung、AT&S、Toshiba、JCET、Qualcomm、IBM、SK Hynix、UTAC、TSMC、China Wafer Level CSP、Interconnect Systems） ・結論

In 2021, the global Wafer Level Package market size will be US$ XX million and it is expected to reach US$ XX million by the end of 2027, with a CAGR of XX% during 2021-2027.
This report focuses on the global Wafer Level Package status, future forecast, growth opportunity, key market, and key players. The study objectives are to present the Wafer Level Package development in North America, Europe, Japan, China, Southeast Asia, India, etc.

Global Wafer Level Package Scope and Market Size
Wafer Level Package market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global Wafer Level Package market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by Type and by Application in terms of revenue and forecast for the period 2016-2027.

Segment by Type
3D Wire Bonding
3D TSV
Others

Segment by Application
Consumer Electronics
Industrial
Automotive & Transport
IT & Telecommunication
Others

By Region
North America
Europe
Japan
China
Southeast Asia
India

By Company
lASE
Amkor
Intel
Samsung
AT&S
Toshiba
JCET
Qualcomm
IBM
SK Hynix
UTAC
TSMC
China Wafer Level CSP
Interconnect Systems

レポート目次

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1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Wafer Level Package Market Size Growth Rate by Type (2021-2027)
1.2.2 3D Wire Bonding
1.2.3 3D TSV
1.2.4 Others
1.3 Market by Application
1.3.1 Global Wafer Level Package Market Share by Application (2021-2027)
1.3.2 Consumer Electronics
1.3.3 Industrial
1.3.4 Automotive & Transport
1.3.5 IT & Telecommunication
1.3.6 Others
1.4 Study Objectives
1.5 Years Considered

2 Executive Summary
2.1 Global Wafer Level Package Market Size
2.2 Wafer Level Package Market Size by Regions
2.2.1 Wafer Level Package Growth Rate by Regions (2021-2027)
2.2.2 Wafer Level Package Market Share by Regions (2021-2027)
2.3 Industry Trends
2.3.1 Market Top Trends
2.3.2 Market Use Cases

3 Key Players
3.1 Wafer Level Package Revenue by Players (2020-2021)
3.2 Wafer Level Package Key Players Headquaters and Area Served
3.3 Key Players Wafer Level Package Product/Solution/Service
3.4 Date of Enter into Wafer Level Package Market
3.5 Mergers & Acquisitions, Expansion Plans

4 Breakdown by Type and by Application
4.1 Global Wafer Level Package Market Size by Type (2021-2027)
4.2 Global Wafer Level Package Market Size by Application (2021-2027)

5 North America
5.1 North America Wafer Level Package Market Forecast (2021-2027)
5.2 Wafer Level Package Key Players in North America
5.3 North America Wafer Level Package Market Size by Type
5.4 North America Wafer Level Package Market Size by Application
6.4.4 Canada

6 Europe
6.1 Europe Wafer Level Package Market Forecast (2021-2027)
6.2 Wafer Level Package Key Players in Europe
6.3 Europe Wafer Level Package Market Size by Type
6.4 Europe Wafer Level Package Market Size by Application

7 Japan
7.1 Japan Wafer Level Package Market Forecast (2021-2027)
7.2 Wafer Level Package Key Players in Europe
7.3 Japan Wafer Level Package Market Size by Type
7.4 Japan Wafer Level Package Market Size by Application

8 Rest of World
8.1 China
8.1.1 China Wafer Level Package Market Analysis
8.1.2 Key Players in China
8.2 Southeast Asia
8.2.1 Southeast Asia Wafer Level Package Market Analysis
8.2.2 Key Players in Southeast Asia
8.3 India
8.3.1 India Wafer Level Package Market Analysis
8.3.2 Key Players in India

9 International Player Profiles
9.1 lASE
9.1.1 lASE Company Details
9.1.2 lASE Description and Business Overview
9.1.3 lASE Wafer Level Package Introduction
9.1.4 lASE Revenue in Wafer Level Package Business (2020-2021)
9.1.5 lASE Recent Development
9.2 Amkor
9.2.1 Amkor Company Details
9.2.2 Amkor Description and Business Overview
9.2.3 Amkor Wafer Level Package Introduction
9.2.4 Amkor Revenue in Wafer Level Package Business (2020-2021)
9.2.5 Amkor Recent Development
9.3 Intel
9.3.1 Intel Company Details
9.3.2 Intel Description and Business Overview
9.3.3 Intel Wafer Level Package Introduction
9.3.4 Intel Revenue in Wafer Level Package Business (2020-2021)
9.3.5 Intel Recent Development
9.4 Samsung
9.4.1 Samsung Company Details
9.4.2 Samsung Description and Business Overview
9.4.3 Samsung Wafer Level Package Introduction
9.4.4 Samsung Revenue in Wafer Level Package Business (2020-2021)
9.4.5 Samsung Recent Development
9.5 AT&S
9.5.1 AT&S Company Details
9.5.2 AT&S Description and Business Overview
9.5.3 AT&S Wafer Level Package Introduction
9.5.4 AT&S Revenue in Wafer Level Package Business (2020-2021)
9.5.5 AT&S Recent Development
9.6 Toshiba
9.6.1 Toshiba Company Details
9.6.2 Toshiba Description and Business Overview
9.6.3 Toshiba Wafer Level Package Introduction
9.6.4 Toshiba Revenue in Wafer Level Package Business (2020-2021)
9.6.5 Toshiba Recent Development
9.7 JCET
9.7.1 JCET Company Details
9.7.2 JCET Description and Business Overview
9.7.3 JCET Wafer Level Package Introduction
9.7.4 JCET Revenue in Wafer Level Package Business (2020-2021)
9.7.5 JCET Recent Development
9.8 Qualcomm
9.8.1 Qualcomm Company Details
9.8.2 Qualcomm Description and Business Overview
9.8.3 Qualcomm Wafer Level Package Introduction
9.8.4 Qualcomm Revenue in Wafer Level Package Business (2020-2021)
9.8.5 Qualcomm Recent Development
9.9 IBM
9.9.1 IBM Company Details
9.9.2 IBM Description and Business Overview
9.9.3 IBM Wafer Level Package Introduction
9.9.4 IBM Revenue in Wafer Level Package Business (2020-2021)
9.9.5 IBM Recent Development
9.10 SK Hynix
9.10.1 SK Hynix Company Details
9.10.2 SK Hynix Description and Business Overview
9.10.3 SK Hynix Wafer Level Package Introduction
9.10.4 SK Hynix Revenue in Wafer Level Package Business (2020-2021)
9.10.5 SK Hynix Recent Development
9.11 UTAC
9.11.1 UTAC Company Details
9.11.2 UTAC Description and Business Overview
9.11.3 UTAC Wafer Level Package Introduction
9.11.4 UTAC Revenue in Wafer Level Package Business (2020-2021)
9.11.5 UTAC Recent Development
9.12 TSMC
9.12.1 TSMC Company Details
9.12.2 TSMC Description and Business Overview
9.12.3 TSMC Wafer Level Package Introduction
9.12.4 TSMC Revenue in Wafer Level Package Business (2020-2021)
9.12.5 TSMC Recent Development
9.13 China Wafer Level CSP
9.13.1 China Wafer Level CSP Company Details
9.13.2 China Wafer Level CSP Description and Business Overview
9.13.3 China Wafer Level CSP Wafer Level Package Introduction
9.13.4 China Wafer Level CSP Revenue in Wafer Level Package Business (2020-2021)
9.13.5 China Wafer Level CSP Recent Development
9.14 Interconnect Systems
9.14.1 Interconnect Systems Company Details
9.14.2 Interconnect Systems Description and Business Overview
9.14.3 Interconnect Systems Wafer Level Package Introduction
9.14.4 Interconnect Systems Revenue in Wafer Level Package Business (2020-2021)
9.14.5 Interconnect Systems Recent Development

10 Market Dynamics
10.1 Industry Trends
10.2 Market Drives
10.3 Market Challenges
10.4 Market Restraints

11 Key Findings in This Report
12 Appendix
12.1 Research Methodology
12.1.1 Methodology/Research Approach
12.1.2 Data Source
12.2 Disclaimer
12.3 Author Details

List of Tables
Table 1. Global Wafer Level Package Market Size Growth Rate by Type (2021-2027) (US$ Million)
Table 2. Key Players of 3D Wire Bonding
Table 3. Key Players of 3D TSV
Table 4. Key Players of Others
Table 5. Global Wafer Level Package Market Size Growth by Application (2021-2027) (US$ Million)
Table 6. Global Wafer Level Package Market Size by Regions (2021-2027) (US$ Million)
Table 7. Global Wafer Level Package Market Share by Regions (2021-2027)
Table 8. Market Top Trends
Table 9. Market Use Cases
Table 10. Global Wafer Level Package Revenue by Players (2020-2021) (US$ Million)
Table 11. Global Wafer Level Package Market Share by Players (2020-2021)
Table 12. Key Players Headquarters and Area Served
Table 13. Key Players Wafer Level Package Product Solution and Service
Table 14. Date of Enter into Wafer Level Package Market
Table 15. Mergers & Acquisitions, Expansion Plans
Table 16. Global Wafer Level Package Market Size by Type (2021-2027) (US$ Million)
Table 17. Global Wafer Level Package Market Size Share by Type (2021-2027)
Table 18. Global Wafer Level Package Market Size by Application (2021-2027) (US$ Million)
Table 19. Global Wafer Level Package Market Size Share by Application (2021-2027)
Table 20. North America Key Players Wafer Level Package Revenue (2020-2021) (US$ Million)
Table 21. North America Key Players Wafer Level Package Market Share (2020-2021)
Table 22. North America Wafer Level Package Market Size by Type (2021-2027) (US$ Million)
Table 23. North America Wafer Level Package Market Share by Type (2021-2027)
Table 24. North America Wafer Level Package Market Size by Application (2021-2027) (US$ Million)
Table 25. North America Wafer Level Package Market Share by Application (2021-2027)
Table 26. Europe Key Players Wafer Level Package Revenue (2020-2021) (US$ Million)
Table 27. Europe Key Players Wafer Level Package Market Share (2020-2021)
Table 28. Europe Wafer Level Package Market Size by Type (2021-2027) (US$ Million)
Table 29. Europe Wafer Level Package Market Share by Type (2021-2027)
Table 30. Europe Wafer Level Package Market Size by Application (2021-2027) (US$ Million)
Table 31. Europe Wafer Level Package Market Share by Application (2021-2027)
Table 32. Japan Key Players Wafer Level Package Revenue (2020-2021) (US$ Million)
Table 33. Japan Key Players Wafer Level Package Market Share (2020-2021)
Table 34. Japan Wafer Level Package Market Size by Type (2021-2027) (US$ Million)
Table 35. Japan Wafer Level Package Market Share by Type (2021-2027)
Table 36. Japan Wafer Level Package Market Size by Application (2021-2027) (US$ Million)
Table 37. Japan Wafer Level Package Market Share by Application (2021-2027)
Table 38. Key Players in China
Table 39. Key Players in Southeast Asia
Table 40. Key Players in India
Table 41. lASE Company Details
Table 42. lASE Description and Business Overview
Table 43. lASE Wafer Level Package Product
Table 44. lASE Revenue in Wafer Level Package Business 2020 and 2021
Table 45. lASE Recent Development
Table 46. Amkor Company Details
Table 47. Amkor Description and Business Overview
Table 48. Amkor Wafer Level Package Product
Table 49. Amkor Revenue in Wafer Level Package Business 2020 and 2021
Table 50. Amkor Recent Development
Table 51. Intel Company Details
Table 52. Intel Description and Business Overview
Table 53. Intel Wafer Level Package Product
Table 54. Intel Revenue in Wafer Level Package Business 2020 and 2021
Table 55. Intel Recent Development
Table 56. Samsung Company Details
Table 57. Samsung Description and Business Overview
Table 58. Samsung Wafer Level Package Product
Table 59. Samsung Revenue in Wafer Level Package Business 2020 and 2021
Table 60. Samsung Recent Development
Table 61. AT&S Company Details
Table 62. AT&S Description and Business Overview
Table 63. AT&S Wafer Level Package Product
Table 64. AT&S Revenue in Wafer Level Package Business 2020 and 2021
Table 65. AT&S Recent Development
Table 66. Toshiba Company Details
Table 67. Toshiba Description and Business Overview
Table 68. Toshiba Wafer Level Package Product
Table 69. Toshiba Revenue in Wafer Level Package Business 2020 and 2021
Table 70. Toshiba Recent Development
Table 71. JCET Company Details
Table 72. JCET Description and Business Overview
Table 73. JCET Wafer Level Package Product
Table 74. JCET Revenue in Wafer Level Package Business 2020 and 2021
Table 75. JCET Recent Development
Table 76. Qualcomm Company Details
Table 77. Qualcomm Description and Business Overview
Table 78. Qualcomm Wafer Level Package Product
Table 79. Qualcomm Revenue in Wafer Level Package Business 2020 and 2021
Table 80. Qualcomm Recent Development
Table 81. IBM Company Details
Table 82. IBM Description and Business Overview
Table 83. IBM Wafer Level Package Product
Table 84. IBM Revenue in Wafer Level Package Business 2020 and 2021
Table 85. IBM Recent Development
Table 86. SK Hynix Company Details
Table 87. SK Hynix Description and Business Overview
Table 88. SK Hynix Wafer Level Package Product
Table 89. SK Hynix Revenue in Wafer Level Package Business 2020 and 2021
Table 90. SK Hynix Recent Development
Table 91. UTAC Company Details
Table 92. UTAC Description and Business Overview
Table 93. UTAC Wafer Level Package Product
Table 94. UTAC Revenue in Wafer Level Package Business 2020 and 2021
Table 95. UTAC Recent Development
Table 96. TSMC Company Details
Table 97. TSMC Description and Business Overview
Table 98. TSMC Wafer Level Package Product
Table 99. TSMC Revenue in Wafer Level Package Business 2020 and 2021
Table 100. TSMC Recent Development
Table 101. China Wafer Level CSP Company Details
Table 102. China Wafer Level CSP Description and Business Overview
Table 103. China Wafer Level CSP Wafer Level Package Product
Table 104. China Wafer Level CSP Revenue in Wafer Level Package Business 2020 and 2021
Table 105. China Wafer Level CSP Recent Development
Table 106. Interconnect Systems Company Details
Table 107. Interconnect Systems Description and Business Overview
Table 108. Interconnect Systems Wafer Level Package Product
Table 109. Interconnect Systems Revenue in Wafer Level Package Business 2020 and 2021
Table 110. Interconnect Systems Recent Development
Table 111. Wafer Level Package Market Trends
Table 112. Wafer Level Package Market Drivers
Table 113. Wafer Level Package Market Challenges
Table 114. Wafer Level Package Market Restraints
Table 115. Research Programs/Design for This Report
Table 116. Key Data Information from Secondary Sources
Table 117. Key Data Information from Primary Sources
List of Figures
Figure 1. Global Wafer Level Package Market Share by Type in 2021 & 2027
Figure 2. 3D Wire Bonding Features
Figure 3. 3D TSV Features
Figure 4. Others Features
Figure 5. Global Wafer Level Package Market Share by Application in 2021 & 2027
Figure 6. Consumer Electronics Case Studies
Figure 7. Industrial Case Studies
Figure 8. Automotive & Transport Case Studies
Figure 9. IT & Telecommunication Case Studies
Figure 10. Others Case Studies
Figure 11. Wafer Level Package Report Years Considered
Figure 12. Global Wafer Level Package Market Size and Growth Rate (2020-2027) (US$ Million)
Figure 13. Global Wafer Level Package Market Share by Regions (2020-2027)
Figure 14. Global Wafer Level Package Market Share by Players in 2021
Figure 15. Global Wafer Level Package Market Size Market Share by Type (2021-2027)
Figure 16. Global Wafer Level Package Market Size Market Share by Application (2021-2027)
Figure 17. Global Wafer Level Package Revenue Market Share by Application in 2021
Figure 18. North America Wafer Level Package Market Size 2021-2027 (US$ Million)
Figure 19. Europe Wafer Level Package Market Size 2021-2027 (US$ Million)
Figure 20. Japan Wafer Level Package Market Size 2021-2027 (US$ Million)
Figure 21. Wafer Level Package Market Size in China (2021-2027) (US$ Million)
Figure 22. Wafer Level Package Market Size in Southeast Asia (2021-2027) (US$ Million)
Figure 23. Wafer Level Package Market Size in India (2021-2027) (US$ Million)
Figure 24. Bottom-up and Top-down Approaches for This Report
Figure 25. Data Triangulation
Figure 26. Key Executives Interviewed

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