• レポートコード:QFJ1-5390 • 出版社/出版日:QYResearch / 2021年6月 ※2024年版があります。お問い合わせください。 • レポート形態:英文、PDF、108ページ • 納品方法:Eメール(納期:3日) • 産業分類:新技術 |
Single User | ¥585,000 (USD3,900) | ▷ お問い合わせ |
Multi User | ¥877,500 (USD5,850) | ▷ お問い合わせ |
• お支払方法:銀行振込(納品後、ご請求書送付)
レポート概要
QYResearch社発行の本調査レポートでは、3Dパッケージの世界市場(2016年~2027年)を対象に調査し、市場動向、主要企業の市場シェア、種類別市場規模(3Dワイヤボンディング、3D TSV、その他)、用途別市場規模(家庭用電化製品、工業用、自動車&輸送、IT&通信、その他)、主要地域別市場規模(北米、アメリカ、欧州、アジア、日本、中国、韓国、インド、東南アジア、中南米、中東、アフリカ等)、企業情報などをまとめております。 ・市場概要 ・3Dパッケージの市場動向 ・企業の競争状況、市場シェア ・3Dパッケージの種類別市場規模と予測2016-2027(3Dワイヤボンディング、3D TSV、その他) ・3Dパッケージの用途別市場規模と予測2016-2027(家庭用電化製品、工業用、自動車&輸送、IT&通信、その他) ・3Dパッケージの北米市場規模2016-2027(アメリカ、カナダ) ・3Dパッケージの欧州市場規模2016-2027(ドイツ、フランス、イギリス等) ・3Dパッケージのアジア市場規模2016-2027(日本、中国、韓国、インド、東南アジア等) ・3Dパッケージの中南米市場規模2016-2027(メキシコ、ブラジル) ・3Dパッケージの中東・アフリカ市場規模2016-2027(トルコ、サウジアラビア等) ・主要企業情報(lASE、Amkor、Intel、Samsung、AT&S、Toshiba、JCET、Qualcomm、IBM、SK Hynix、UTAC、TSMC、China Wafer Level CSP、Interconnect Systems) ・結論 |
In 2021, the global 3D Packaging market size will be US$ XX million and it is expected to reach US$ XX million by the end of 2027, with a CAGR of XX% during 2021-2027.
This report focuses on the global 3D Packaging status, future forecast, growth opportunity, key market, and key players. The study objectives are to present the 3D Packaging development in North America, Europe, Japan, China, Southeast Asia, India, etc.
Global 3D Packaging Scope and Market Size
3D Packaging market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global 3D Packaging market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by Type and by Application in terms of revenue and forecast for the period 2016-2027.
Segment by Type
3D Wire Bonding
3D TSV
Others
Segment by Application
Consumer Electronics
Industrial
Automotive & Transport
IT & Telecommunication
Others
By Region
North America
Europe
Japan
China
Southeast Asia
India
By Company
lASE
Amkor
Intel
Samsung
AT&S
Toshiba
JCET
Qualcomm
IBM
SK Hynix
UTAC
TSMC
China Wafer Level CSP
Interconnect Systems
1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global 3D Packaging Market Size Growth Rate by Type (2021-2027)
1.2.2 3D Wire Bonding
1.2.3 3D TSV
1.2.4 Others
1.3 Market by Application
1.3.1 Global 3D Packaging Market Share by Application (2021-2027)
1.3.2 Consumer Electronics
1.3.3 Industrial
1.3.4 Automotive & Transport
1.3.5 IT & Telecommunication
1.3.6 Others
1.4 Study Objectives
1.5 Years Considered
2 Executive Summary
2.1 Global 3D Packaging Market Size
2.2 3D Packaging Market Size by Regions
2.2.1 3D Packaging Growth Rate by Regions (2021-2027)
2.2.2 3D Packaging Market Share by Regions (2021-2027)
2.3 Industry Trends
2.3.1 Market Top Trends
2.3.2 Market Use Cases
3 Key Players
3.1 3D Packaging Revenue by Players (2020-2021)
3.2 3D Packaging Key Players Headquaters and Area Served
3.3 Key Players 3D Packaging Product/Solution/Service
3.4 Date of Enter into 3D Packaging Market
3.5 Mergers & Acquisitions, Expansion Plans
4 Breakdown by Type and by Application
4.1 Global 3D Packaging Market Size by Type (2021-2027)
4.2 Global 3D Packaging Market Size by Application (2021-2027)
5 North America
5.1 North America 3D Packaging Market Forecast (2021-2027)
5.2 3D Packaging Key Players in North America
5.3 North America 3D Packaging Market Size by Type
5.4 North America 3D Packaging Market Size by Application
6.4.4 Canada
6 Europe
6.1 Europe 3D Packaging Market Forecast (2021-2027)
6.2 3D Packaging Key Players in Europe
6.3 Europe 3D Packaging Market Size by Type
6.4 Europe 3D Packaging Market Size by Application
7 Japan
7.1 Japan 3D Packaging Market Forecast (2021-2027)
7.2 3D Packaging Key Players in Europe
7.3 Japan 3D Packaging Market Size by Type
7.4 Japan 3D Packaging Market Size by Application
8 Rest of World
8.1 China
8.1.1 China 3D Packaging Market Analysis
8.1.2 Key Players in China
8.2 Southeast Asia
8.2.1 Southeast Asia 3D Packaging Market Analysis
8.2.2 Key Players in Southeast Asia
8.3 India
8.3.1 India 3D Packaging Market Analysis
8.3.2 Key Players in India
9 International Player Profiles
9.1 lASE
9.1.1 lASE Company Details
9.1.2 lASE Description and Business Overview
9.1.3 lASE 3D Packaging Introduction
9.1.4 lASE Revenue in 3D Packaging Business (2020-2021)
9.1.5 lASE Recent Development
9.2 Amkor
9.2.1 Amkor Company Details
9.2.2 Amkor Description and Business Overview
9.2.3 Amkor 3D Packaging Introduction
9.2.4 Amkor Revenue in 3D Packaging Business (2020-2021)
9.2.5 Amkor Recent Development
9.3 Intel
9.3.1 Intel Company Details
9.3.2 Intel Description and Business Overview
9.3.3 Intel 3D Packaging Introduction
9.3.4 Intel Revenue in 3D Packaging Business (2020-2021)
9.3.5 Intel Recent Development
9.4 Samsung
9.4.1 Samsung Company Details
9.4.2 Samsung Description and Business Overview
9.4.3 Samsung 3D Packaging Introduction
9.4.4 Samsung Revenue in 3D Packaging Business (2020-2021)
9.4.5 Samsung Recent Development
9.5 AT&S
9.5.1 AT&S Company Details
9.5.2 AT&S Description and Business Overview
9.5.3 AT&S 3D Packaging Introduction
9.5.4 AT&S Revenue in 3D Packaging Business (2020-2021)
9.5.5 AT&S Recent Development
9.6 Toshiba
9.6.1 Toshiba Company Details
9.6.2 Toshiba Description and Business Overview
9.6.3 Toshiba 3D Packaging Introduction
9.6.4 Toshiba Revenue in 3D Packaging Business (2020-2021)
9.6.5 Toshiba Recent Development
9.7 JCET
9.7.1 JCET Company Details
9.7.2 JCET Description and Business Overview
9.7.3 JCET 3D Packaging Introduction
9.7.4 JCET Revenue in 3D Packaging Business (2020-2021)
9.7.5 JCET Recent Development
9.8 Qualcomm
9.8.1 Qualcomm Company Details
9.8.2 Qualcomm Description and Business Overview
9.8.3 Qualcomm 3D Packaging Introduction
9.8.4 Qualcomm Revenue in 3D Packaging Business (2020-2021)
9.8.5 Qualcomm Recent Development
9.9 IBM
9.9.1 IBM Company Details
9.9.2 IBM Description and Business Overview
9.9.3 IBM 3D Packaging Introduction
9.9.4 IBM Revenue in 3D Packaging Business (2020-2021)
9.9.5 IBM Recent Development
9.10 SK Hynix
9.10.1 SK Hynix Company Details
9.10.2 SK Hynix Description and Business Overview
9.10.3 SK Hynix 3D Packaging Introduction
9.10.4 SK Hynix Revenue in 3D Packaging Business (2020-2021)
9.10.5 SK Hynix Recent Development
9.11 UTAC
9.11.1 UTAC Company Details
9.11.2 UTAC Description and Business Overview
9.11.3 UTAC 3D Packaging Introduction
9.11.4 UTAC Revenue in 3D Packaging Business (2020-2021)
9.11.5 UTAC Recent Development
9.12 TSMC
9.12.1 TSMC Company Details
9.12.2 TSMC Description and Business Overview
9.12.3 TSMC 3D Packaging Introduction
9.12.4 TSMC Revenue in 3D Packaging Business (2020-2021)
9.12.5 TSMC Recent Development
9.13 China Wafer Level CSP
9.13.1 China Wafer Level CSP Company Details
9.13.2 China Wafer Level CSP Description and Business Overview
9.13.3 China Wafer Level CSP 3D Packaging Introduction
9.13.4 China Wafer Level CSP Revenue in 3D Packaging Business (2020-2021)
9.13.5 China Wafer Level CSP Recent Development
9.14 Interconnect Systems
9.14.1 Interconnect Systems Company Details
9.14.2 Interconnect Systems Description and Business Overview
9.14.3 Interconnect Systems 3D Packaging Introduction
9.14.4 Interconnect Systems Revenue in 3D Packaging Business (2020-2021)
9.14.5 Interconnect Systems Recent Development
10 Market Dynamics
10.1 Industry Trends
10.2 Market Drives
10.3 Market Challenges
10.4 Market Restraints
11 Key Findings in This Report
12 Appendix
12.1 Research Methodology
12.1.1 Methodology/Research Approach
12.1.2 Data Source
12.2 Disclaimer
12.3 Author Details
Table 1. Global 3D Packaging Market Size Growth Rate by Type (2021-2027) (US$ Million)
Table 2. Key Players of 3D Wire Bonding
Table 3. Key Players of 3D TSV
Table 4. Key Players of Others
Table 5. Global 3D Packaging Market Size Growth by Application (2021-2027) (US$ Million)
Table 6. Global 3D Packaging Market Size by Regions (2021-2027) (US$ Million)
Table 7. Global 3D Packaging Market Share by Regions (2021-2027)
Table 8. Market Top Trends
Table 9. Market Use Cases
Table 10. Global 3D Packaging Revenue by Players (2020-2021) (US$ Million)
Table 11. Global 3D Packaging Market Share by Players (2020-2021)
Table 12. Key Players Headquarters and Area Served
Table 13. Key Players 3D Packaging Product Solution and Service
Table 14. Date of Enter into 3D Packaging Market
Table 15. Mergers & Acquisitions, Expansion Plans
Table 16. Global 3D Packaging Market Size by Type (2021-2027) (US$ Million)
Table 17. Global 3D Packaging Market Size Share by Type (2021-2027)
Table 18. Global 3D Packaging Market Size by Application (2021-2027) (US$ Million)
Table 19. Global 3D Packaging Market Size Share by Application (2021-2027)
Table 20. North America Key Players 3D Packaging Revenue (2020-2021) (US$ Million)
Table 21. North America Key Players 3D Packaging Market Share (2020-2021)
Table 22. North America 3D Packaging Market Size by Type (2021-2027) (US$ Million)
Table 23. North America 3D Packaging Market Share by Type (2021-2027)
Table 24. North America 3D Packaging Market Size by Application (2021-2027) (US$ Million)
Table 25. North America 3D Packaging Market Share by Application (2021-2027)
Table 26. Europe Key Players 3D Packaging Revenue (2020-2021) (US$ Million)
Table 27. Europe Key Players 3D Packaging Market Share (2020-2021)
Table 28. Europe 3D Packaging Market Size by Type (2021-2027) (US$ Million)
Table 29. Europe 3D Packaging Market Share by Type (2021-2027)
Table 30. Europe 3D Packaging Market Size by Application (2021-2027) (US$ Million)
Table 31. Europe 3D Packaging Market Share by Application (2021-2027)
Table 32. Japan Key Players 3D Packaging Revenue (2020-2021) (US$ Million)
Table 33. Japan Key Players 3D Packaging Market Share (2020-2021)
Table 34. Japan 3D Packaging Market Size by Type (2021-2027) (US$ Million)
Table 35. Japan 3D Packaging Market Share by Type (2021-2027)
Table 36. Japan 3D Packaging Market Size by Application (2021-2027) (US$ Million)
Table 37. Japan 3D Packaging Market Share by Application (2021-2027)
Table 38. Key Players in China
Table 39. Key Players in Southeast Asia
Table 40. Key Players in India
Table 41. lASE Company Details
Table 42. lASE Description and Business Overview
Table 43. lASE 3D Packaging Product
Table 44. lASE Revenue in 3D Packaging Business 2020 and 2021
Table 45. lASE Recent Development
Table 46. Amkor Company Details
Table 47. Amkor Description and Business Overview
Table 48. Amkor 3D Packaging Product
Table 49. Amkor Revenue in 3D Packaging Business 2020 and 2021
Table 50. Amkor Recent Development
Table 51. Intel Company Details
Table 52. Intel Description and Business Overview
Table 53. Intel 3D Packaging Product
Table 54. Intel Revenue in 3D Packaging Business 2020 and 2021
Table 55. Intel Recent Development
Table 56. Samsung Company Details
Table 57. Samsung Description and Business Overview
Table 58. Samsung 3D Packaging Product
Table 59. Samsung Revenue in 3D Packaging Business 2020 and 2021
Table 60. Samsung Recent Development
Table 61. AT&S Company Details
Table 62. AT&S Description and Business Overview
Table 63. AT&S 3D Packaging Product
Table 64. AT&S Revenue in 3D Packaging Business 2020 and 2021
Table 65. AT&S Recent Development
Table 66. Toshiba Company Details
Table 67. Toshiba Description and Business Overview
Table 68. Toshiba 3D Packaging Product
Table 69. Toshiba Revenue in 3D Packaging Business 2020 and 2021
Table 70. Toshiba Recent Development
Table 71. JCET Company Details
Table 72. JCET Description and Business Overview
Table 73. JCET 3D Packaging Product
Table 74. JCET Revenue in 3D Packaging Business 2020 and 2021
Table 75. JCET Recent Development
Table 76. Qualcomm Company Details
Table 77. Qualcomm Description and Business Overview
Table 78. Qualcomm 3D Packaging Product
Table 79. Qualcomm Revenue in 3D Packaging Business 2020 and 2021
Table 80. Qualcomm Recent Development
Table 81. IBM Company Details
Table 82. IBM Description and Business Overview
Table 83. IBM 3D Packaging Product
Table 84. IBM Revenue in 3D Packaging Business 2020 and 2021
Table 85. IBM Recent Development
Table 86. SK Hynix Company Details
Table 87. SK Hynix Description and Business Overview
Table 88. SK Hynix 3D Packaging Product
Table 89. SK Hynix Revenue in 3D Packaging Business 2020 and 2021
Table 90. SK Hynix Recent Development
Table 91. UTAC Company Details
Table 92. UTAC Description and Business Overview
Table 93. UTAC 3D Packaging Product
Table 94. UTAC Revenue in 3D Packaging Business 2020 and 2021
Table 95. UTAC Recent Development
Table 96. TSMC Company Details
Table 97. TSMC Description and Business Overview
Table 98. TSMC 3D Packaging Product
Table 99. TSMC Revenue in 3D Packaging Business 2020 and 2021
Table 100. TSMC Recent Development
Table 101. China Wafer Level CSP Company Details
Table 102. China Wafer Level CSP Description and Business Overview
Table 103. China Wafer Level CSP 3D Packaging Product
Table 104. China Wafer Level CSP Revenue in 3D Packaging Business 2020 and 2021
Table 105. China Wafer Level CSP Recent Development
Table 106. Interconnect Systems Company Details
Table 107. Interconnect Systems Description and Business Overview
Table 108. Interconnect Systems 3D Packaging Product
Table 109. Interconnect Systems Revenue in 3D Packaging Business 2020 and 2021
Table 110. Interconnect Systems Recent Development
Table 111. 3D Packaging Market Trends
Table 112. 3D Packaging Market Drivers
Table 113. 3D Packaging Market Challenges
Table 114. 3D Packaging Market Restraints
Table 115. Research Programs/Design for This Report
Table 116. Key Data Information from Secondary Sources
Table 117. Key Data Information from Primary Sources
List of Figures
Figure 1. Global 3D Packaging Market Share by Type in 2021 & 2027
Figure 2. 3D Wire Bonding Features
Figure 3. 3D TSV Features
Figure 4. Others Features
Figure 5. Global 3D Packaging Market Share by Application in 2021 & 2027
Figure 6. Consumer Electronics Case Studies
Figure 7. Industrial Case Studies
Figure 8. Automotive & Transport Case Studies
Figure 9. IT & Telecommunication Case Studies
Figure 10. Others Case Studies
Figure 11. 3D Packaging Report Years Considered
Figure 12. Global 3D Packaging Market Size and Growth Rate (2020-2027) (US$ Million)
Figure 13. Global 3D Packaging Market Share by Regions (2020-2027)
Figure 14. Global 3D Packaging Market Share by Players in 2021
Figure 15. Global 3D Packaging Market Size Market Share by Type (2021-2027)
Figure 16. Global 3D Packaging Market Size Market Share by Application (2021-2027)
Figure 17. Global 3D Packaging Revenue Market Share by Application in 2021
Figure 18. North America 3D Packaging Market Size 2021-2027 (US$ Million)
Figure 19. Europe 3D Packaging Market Size 2021-2027 (US$ Million)
Figure 20. Japan 3D Packaging Market Size 2021-2027 (US$ Million)
Figure 21. 3D Packaging Market Size in China (2021-2027) (US$ Million)
Figure 22. 3D Packaging Market Size in Southeast Asia (2021-2027) (US$ Million)
Figure 23. 3D Packaging Market Size in India (2021-2027) (US$ Million)
Figure 24. Bottom-up and Top-down Approaches for This Report
Figure 25. Data Triangulation
Figure 26. Key Executives Interviewed